Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854893 | Method of manufacturing semiconductor package | Junyun Kweon, Jumyong Park, Solji Song, Dongjoon Oh, Hyunsu Hwang | 2023-12-26 |
| 11824076 | Semiconductor package including an image sensor chip and a method of fabricating the same | Yonghoe Cho, Yoonha Jung, Chajea Jo | 2023-11-21 |
| 11705323 | Wafer trimming device | Jungseok Ahn, Unbyoung Kang, Teakhoon Lee | 2023-07-18 |
| 11688679 | Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structure | Ji-Seok Hong, Dongwoo Kim, Hyunah KIM, Un-Byoung Kang | 2023-06-27 |
| 11664312 | Semiconductor device and semiconductor package including the same | Ju-Il Choi, Gyuho Kang, Seong-Hoon Bae, Dongjoon Oh, Hyunsu Hwang | 2023-05-30 |
| 11637058 | Interconnection structure and semiconductor package including the same | Ju-Il Choi, Jumyong Park, Jin Ho An, Teahwa Jeong, Jeonggi Jin | 2023-04-25 |