Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854893 | Method of manufacturing semiconductor package | Junyun Kweon, Jumyong Park, Solji Song, Chungsun Lee, Hyunsu Hwang | 2023-12-26 |
| 11798872 | Interconnection structure and semiconductor package including the same | Junyun Kweon, Jumyong Park, Jin Ho An, Jeonggi Jin, Hyunsu Hwang | 2023-10-24 |
| 11664312 | Semiconductor device and semiconductor package including the same | Ju-Il Choi, Gyuho Kang, Seong-Hoon Bae, Chungsun Lee, Hyunsu Hwang | 2023-05-30 |
| 11652066 | Semiconductor package | Sukho Lee, Jusuk Kang | 2023-05-16 |