Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854893 | Method of manufacturing semiconductor package | Junyun Kweon, Solji Song, Dongjoon Oh, Chungsun Lee, Hyunsu Hwang | 2023-12-26 |
| 11798872 | Interconnection structure and semiconductor package including the same | Junyun Kweon, Jin Ho An, Dongjoon Oh, Jeonggi Jin, Hyunsu Hwang | 2023-10-24 |
| 11637058 | Interconnection structure and semiconductor package including the same | Ju-Il Choi, Jin Ho An, Chungsun Lee, Teahwa Jeong, Jeonggi Jin | 2023-04-25 |