Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854893 | Method of manufacturing semiconductor package | Junyun Kweon, Jumyong Park, Dongjoon Oh, Chungsun Lee, Hyunsu Hwang | 2023-12-26 |
| 11676887 | Semiconductor package | Jeonggi Jin, Gyuho Kang, Un-Byoung Kang, Ju-Il Choi | 2023-06-13 |