Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735494 | Semiconductor package | Hee Jeong Kim, Juhyun Lyu, Jongho Lee | 2023-08-22 |
| 11694996 | Semiconductor package including a pad contacting a via | Hyuekjae Lee, Sang Cheon Park, Jinkyeong Seol, Sanghoon Lee | 2023-07-04 |
| 11694978 | Semiconductor devices and semiconductor packages including the same | Ju-Il Choi, Jin Ho An, Jongho Lee, Jeonggi Jin, Atsushi Fujisaki | 2023-07-04 |
| 11688679 | Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structure | Ji-Seok Hong, Dongwoo Kim, Hyunah KIM, Chungsun Lee | 2023-06-27 |
| 11682630 | Semiconductor package | Ju-Il Choi, Gyuho Kang, Byeongchan KIM, Junyoung Park, Jongho Lee +1 more | 2023-06-20 |
| 11676887 | Semiconductor package | Jeonggi Jin, Gyuho Kang, Solji Song, Ju-Il Choi | 2023-06-13 |
| 11658131 | Semiconductor package with dummy pattern not electrically connected to circuit pattern | Jin-Woo Park, Jong Ho Lee | 2023-05-23 |
| 11621250 | Semiconductor packages | Joonho Jun, Sunkyoung Seo, Jongho Lee, Young Kun Jee | 2023-04-04 |
| 11616039 | Semiconductor package | Sang-Sick Park, Seon Gyo Kim, Joon Ho Jun | 2023-03-28 |
| 11594499 | Semiconductor package | Yeongkwon Ko, Jaekyung Yoo, Teak-Hoon Lee | 2023-02-28 |