Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735494 | Semiconductor package | Hee Jeong Kim, Un-Byoung Kang, Jongho Lee | 2023-08-22 |
| 11670565 | Semiconductor package with heat dissipation member | Hyo-Chang Ryu, Chulwoo Kim, Sanghyun Lee, Yun-Seok Choi | 2023-06-06 |
| 11569145 | Semiconductor package with thermal interface material for improving package reliability | Sanghyun Lee, Unbyoung Kang, Chulwoo Kim, Jongho Lee | 2023-01-31 |