Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721679 | Semiconductor package and method of fabricating the same | Yanggyoo Jung, Chulwoo Kim, Yun-Seok Choi | 2023-08-08 |
| 11670565 | Semiconductor package with heat dissipation member | Chulwoo Kim, Juhyun Lyu, Sanghyun Lee, Yun-Seok Choi | 2023-06-06 |