Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721679 | Semiconductor package and method of fabricating the same | Chulwoo Kim, Hyo-Chang Ryu, Yun-Seok Choi | 2023-08-08 |
| 11694961 | Semiconductor package having an interposer and method of manufacturing semiconductor package | Jinhyun Kang, Sungeun Kim, Sangmin Yong, Seungkwan Ryu | 2023-07-04 |