Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728255 | Interposer and semiconductor package including same | Ungcheon Kim, Sungwoo Park, Yukyung Park | 2023-08-15 |
| 11694961 | Semiconductor package having an interposer and method of manufacturing semiconductor package | Yanggyoo Jung, Jinhyun Kang, Sungeun Kim, Sangmin Yong | 2023-07-04 |
| 11587859 | Wiring protection layer on an interposer with a through electrode | Yukyung Park, Yunseok Choi | 2023-02-21 |