Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11694961 | Semiconductor package having an interposer and method of manufacturing semiconductor package | Yanggyoo Jung, Jinhyun Kang, Sungeun Kim, Seungkwan Ryu | 2023-07-04 |
SY
Sangmin Yong
Overall (2023): #265,059 of 537,848Top 50%
1
Patents 2023