Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11664352 | Semiconductor package having a high reliability | Ji Hwan Hwang, Tae Hong Min, Geol Nam | 2023-05-30 |
| 11616039 | Semiconductor package | Un-Byoung Kang, Seon Gyo Kim, Joon Ho Jun | 2023-03-28 |