Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769622 | Inductor device and method of manufacturing the same | In Seok KIM, Yong Jin Park, Young Gwan Ko, Youn-Soo Seo, Myung Sam Kang | 2023-09-26 |
| 11737211 | Connection structure embedded substrate and substrate structure including the same | Ho Hyung Ham, Yong Soon Jang, Ki-Suk Kim, Hyung Ki Lee, Chi Won Hwang | 2023-08-22 |
| 11664352 | Semiconductor package having a high reliability | Ji Hwan Hwang, Sang-Sick Park, Geol Nam | 2023-05-30 |
| 11558961 | Printed circuit board | Jungwoo Choi | 2023-01-17 |