Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848274 | Semiconductor package | Gunho CHANG | 2023-12-19 |
| 11705430 | Semiconductor package including mold layer having curved cross-section shape | Taehyeong Kim, Young Lyong Kim | 2023-07-18 |
| 11664352 | Semiconductor package having a high reliability | Ji Hwan Hwang, Sang-Sick Park, Tae Hong Min | 2023-05-30 |