Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721601 | Semiconductor package and method of manufacturing the same | Hyeongmun Kang, Jungmin Ko, Seungduk Baek, Insup Shin | 2023-08-08 |
| 11705430 | Semiconductor package including mold layer having curved cross-section shape | Young Lyong Kim, Geol Nam | 2023-07-18 |
| 11635821 | Electronic apparatus and controlling method thereof | Joonah Park, Jaeyong Ju, Jaeha Lee | 2023-04-25 |
| 11544531 | Method and apparatus for generating story from plurality of images by using deep learning network | Byoung-Tak Zhang, Min-Oh Heo, Seon Il Son, Kyung-Wha Park | 2023-01-03 |