Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756935 | Chip-stacked semiconductor package with increased package reliability | Insup Shin, Jungmin Ko, Hwanyoung Choi | 2023-09-12 |
| 11721601 | Semiconductor package and method of manufacturing the same | Jungmin Ko, Seungduk Baek, Taehyeong Kim, Insup Shin | 2023-08-08 |
| 11658160 | Semiconductor package and method of manufacturing the same | Hyeonjun Song, Eunkyul Oh, Jungmin Ko | 2023-05-23 |