Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721601 | Semiconductor package and method of manufacturing the same | Hyeongmun Kang, Jungmin Ko, Taehyeong Kim, Insup Shin | 2023-08-08 |
| 11721604 | Semiconductor package | Dongjoo CHOI, Youngdeuk Kim | 2023-08-08 |
| 11640951 | Integrated circuit device having redistribution pattern | Yunrae Cho, Jinyeol Yang, Jungmin Ko | 2023-05-02 |