Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776894 | Semiconductor chip including low-k dielectric layer | Yeonjin Lee, Junyong Noh, Minjung Choi, Junghoon Han | 2023-10-03 |
| 11769755 | Semiconductor package and method of fabricating the same | Eunkyul Oh, Taeheon Kim, Seunghun Han | 2023-09-26 |
| 11640951 | Integrated circuit device having redistribution pattern | Jinyeol Yang, Jungmin Ko, Seungduk Baek | 2023-05-02 |