Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817408 | Semiconductor devices including a thick metal layer and a bump | Sooho Shin, Yeonjin Lee, Junghoon Han | 2023-11-14 |
| 11776894 | Semiconductor chip including low-k dielectric layer | Yeonjin Lee, Junyong Noh, Junghoon Han, Yunrae Cho | 2023-10-03 |
| 11756843 | Semiconductor devices including scribe lane and method of manufacturing the semiconductor devices | Junyong Noh, Yeonjin Lee, Junghoon Han | 2023-09-12 |
| 11670559 | Semiconductor device | Jung-Hoon Han, Jiho Kim, Young-Yong Byun, Yeonjin Lee, Jihoon Chang | 2023-06-06 |
| 11557556 | Semiconductor devices including a thick metal layer and a bump | Sooho Shin, Yeonjin Lee, Junghoon Han | 2023-01-17 |