Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817408 | Semiconductor devices including a thick metal layer and a bump | Minjung Choi, Yeonjin Lee, Junghoon Han | 2023-11-14 |
| 11723191 | Semiconductor memory devices having protruding contact portions | Minsu Choi, Myeong-Dong Lee, Hyeon-Woo Jang, Keunnam Kim, Yoosang Hwang | 2023-08-08 |
| 11557556 | Semiconductor devices including a thick metal layer and a bump | Minjung Choi, Yeonjin Lee, Junghoon Han | 2023-01-17 |