Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769755 | Semiconductor package and method of fabricating the same | Eunkyul Oh, Yunrae Cho, Taeheon Kim | 2023-09-26 |
| 11634575 | Thermoplastic resin composition, method of preparing the same, and molded article including the same | Suk Jo CHOI, Jinoh Nam, Seong Lyong Kim | 2023-04-25 |