Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830853 | Semiconductor devices and methods for manufacturing the same | Ae-Nee Jang | 2023-11-28 |
| 11817411 | Semiconductor package and method of fabricating the same | — | 2023-11-14 |
| 11705430 | Semiconductor package including mold layer having curved cross-section shape | Taehyeong Kim, Geol Nam | 2023-07-18 |