Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11765820 | Printed circuit board | Jae Heun LEE | 2023-09-19 |
| 11737211 | Connection structure embedded substrate and substrate structure including the same | Tae Hong Min, Ho Hyung Ham, Ki-Suk Kim, Hyung Ki Lee, Chi Won Hwang | 2023-08-22 |
| 11658124 | Connection structure embedded substrate | Hyung Ki Lee, Ki-Suk Kim | 2023-05-23 |