Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824006 | Semiconductor package | Byoung-Soo Kwak | 2023-11-21 |
| 11688679 | Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structure | Dongwoo Kim, Hyunah KIM, Un-Byoung Kang, Chungsun Lee | 2023-06-27 |
| 11658148 | Semiconductor package and a method for manufacturing the same | Hyuekjae Lee, Jihoon Kim, Jihwan Suh, So Youn Lee, Jihwan Hwang +1 more | 2023-05-23 |
| 11581257 | Semiconductor package | Hyuek Jae Lee, Ji Hoon Kim, Tae Hun Kim, Ji Hwan Hwang | 2023-02-14 |