Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11694996 | Semiconductor package including a pad contacting a via | Hyuekjae Lee, Un-Byoung Kang, Sang Cheon Park, Sanghoon Lee | 2023-07-04 |
| 11557574 | Semiconductor package | Sunchul Kim, Pyoungwan Kim | 2023-01-17 |
| 11552033 | Packaged multi-chip semiconductor devices and methods of fabricating same | Hyuekjae Lee, Jongho Lee, Jihoon Kim, Taehun Kim, Sangcheon Park +1 more | 2023-01-10 |