Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791282 | Semiconductor package including part of underfill on portion of a molding material surrounding sides of logic chip and memory stack on interposer and method for manufacturing the same | Yeongkwon Ko, Jayeon LEE, Jaeeun Lee, Teakhoon Lee | 2023-10-17 |
| 11594499 | Semiconductor package | Yeongkwon Ko, Un-Byoung Kang, Teak-Hoon Lee | 2023-02-28 |