Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791282 | Semiconductor package including part of underfill on portion of a molding material surrounding sides of logic chip and memory stack on interposer and method for manufacturing the same | Jaekyung Yoo, Yeongkwon Ko, Jayeon LEE, Teakhoon Lee | 2023-10-17 |
| 11735522 | Semiconductor device including plurality of patterns | Hyoseok Woo, Hyunsook Yoon, Junseok Kim | 2023-08-22 |
| 11694963 | Semiconductor device and semiconductor package including the same | Yeongkwon Ko, Junyeong Heo | 2023-07-04 |