Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721669 | Semiconductor package including a first semiconductor stack and a second semiconductor stack of different widths | Jae Eun Lee, Yeongkwon Ko, Donghoon Won | 2023-08-08 |
| 11694963 | Semiconductor device and semiconductor package including the same | Yeongkwon Ko, Jaeeun Lee | 2023-07-04 |