Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848293 | Semiconductor package | Sunkyoung Seo, Teak-Hoon Lee | 2023-12-19 |
| 11824076 | Semiconductor package including an image sensor chip and a method of fabricating the same | Yonghoe Cho, Chungsun Lee, Yoonha Jung | 2023-11-21 |
| 11776941 | Semiconductor package | Yonghoe Cho, Sunkyoung Seo | 2023-10-03 |
| 11626385 | Semiconductor package | Namhoon Kim, Ohguk KWON, Hyoeun Kim, Seunghoon Yeon | 2023-04-11 |
| 11600608 | Semiconductor package | Jichul Kim, Sang-Uk Han, Kyoung Soon Cho, Jae Choon Kim, Woohyun Park | 2023-03-07 |
| 11569201 | Semiconductor package and method of fabricating the same | Hyoeun Kim, Ji Hwang Kim, Jisun YANG, Seunghoon Yeon, Sang-Uk Han | 2023-01-31 |
| 11545417 | Integrated circuit device and semiconductor package including the same | Ohguk KWON, Namhoon Kim, Hyoeun Kim, Seunghoon Yeon | 2023-01-03 |
| 11545512 | Image sensor package with underfill and image sensor module including the same | Ohguk KWON, Hyoeun Kim, Seunghoon Yeon | 2023-01-03 |