Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728230 | Semiconductor package and method of fabricating the same | Dongho Kim, Jin-Woo Park, Jongbo Shim | 2023-08-15 |
| 11658107 | Semiconductor package including an interposer and method of fabricating the same | Hyunkyu Kim, Jongbo Shim, Eunhee Jung, Kyoungsei Choi | 2023-05-23 |
| 11637140 | Image sensor package | Jong Bo Shim, Sang-Uk Han, Cha-Jea Jo, Won-Il Lee | 2023-04-25 |
| 11600545 | Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor package | Jong Bo Shim, Jang-woo Lee, Yung-Cheol Kong, Young Hoon Hyun | 2023-03-07 |
| 11569201 | Semiconductor package and method of fabricating the same | Hyoeun Kim, Jisun YANG, Seunghoon Yeon, Chajea Jo, Sang-Uk Han | 2023-01-31 |