Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11600545 | Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor package | Ji Hwang Kim, Jong Bo Shim, Jang-woo Lee, Young Hoon Hyun | 2023-03-07 |