Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658107 | Semiconductor package including an interposer and method of fabricating the same | Ji Hwang Kim, Hyunkyu Kim, Jongbo Shim, Kyoungsei Choi | 2023-05-23 |
EJ
Eunhee Jung
Overall (2023): #450,807 of 537,848Top 85%
1
Patents 2023