Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830803 | Chip-on-film package having redistribution pattern between semiconductor chip and connection terminal | KwanJai Lee, Jae-Min Jung, Jeong-Kyu Ha | 2023-11-28 |
| 11764140 | Semiconductor device | Duck Gyu KIM, Min Ki Kim, Jae-Min Jung, Jeong-Kyu Ha | 2023-09-19 |
| 11710757 | Semiconductor package and method of fabricating the same | Ohguk KWON, Hyoeun Kim, Sunkyoung Seo | 2023-07-25 |
| 11637140 | Image sensor package | Ji Hwang Kim, Jong Bo Shim, Cha-Jea Jo, Won-Il Lee | 2023-04-25 |
| 11600608 | Semiconductor package | Jichul Kim, Chajea Jo, Kyoung Soon Cho, Jae Choon Kim, Woohyun Park | 2023-03-07 |
| 11600556 | Semiconductor package | Minki Kim, Duckgyu Kim, Jae-Min Jung, Jeong-Kyu Ha | 2023-03-07 |
| 11569201 | Semiconductor package and method of fabricating the same | Hyoeun Kim, Ji Hwang Kim, Jisun YANG, Seunghoon Yeon, Chajea Jo | 2023-01-31 |