Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830803 | Chip-on-film package having redistribution pattern between semiconductor chip and connection terminal | KwanJai Lee, Jae-Min Jung, Sang-Uk Han | 2023-11-28 |
| 11764140 | Semiconductor device | Sang-Uk Han, Duck Gyu KIM, Min Ki Kim, Jae-Min Jung | 2023-09-19 |
| 11600556 | Semiconductor package | Minki Kim, Duckgyu Kim, Jae-Min Jung, Sang-Uk Han | 2023-03-07 |