KL

KwanJai Lee

Samsung: 1 patents #7,162 of 17,037Top 45%
📍 Yongin-si, KR: #1,315 of 2,785 inventorsTop 50%
Overall (2023): #359,466 of 537,848Top 70%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11830803 Chip-on-film package having redistribution pattern between semiconductor chip and connection terminal Jae-Min Jung, Jeong-Kyu Ha, Sang-Uk Han 2023-11-28