Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756869 | Semiconductor package having UBM pad with gap separating central portion from peripheral portion | Gayoung Kim | 2023-09-12 |
| 11728261 | Chip on film package and display apparatus including the same | — | 2023-08-15 |
| 11682633 | Semiconductor package | Ji-Yong Park | 2023-06-20 |
| 11600556 | Semiconductor package | Minki Kim, Jae-Min Jung, Jeong-Kyu Ha, Sang-Uk Han | 2023-03-07 |