Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854989 | Semiconductor package substrate and semiconductor package including the same | Jongbo Shim, Hwan Pil Park, Choongbin Yim, Jungwoo Kim | 2023-12-26 |
| 11824663 | Electronic device managing communication buffer and operating method thereof | Jongmin BAIK, Jusung LEE | 2023-11-21 |
| 11817401 | Semiconductor package including molding layer | Jihwang Kim | 2023-11-14 |
| 11784883 | Automation agent for network equipment configuration | Ioannis Broustis | 2023-10-10 |
| 11776988 | Micro light-emitting display apparatus and method of manufacturing the same | Junhee Choi, Kiho Kong, Nakhyun Kim, Junghun Park, Jinjoo Park +2 more | 2023-10-03 |
| 11776913 | Semiconductor package and a package-on-package including the same | Hwanpil Park | 2023-10-03 |
| 11728230 | Semiconductor package and method of fabricating the same | Ji Hwang Kim, Jin-Woo Park, Jongbo Shim | 2023-08-15 |
| 11699642 | Semiconductor package including redistributed layer and method for fabrication therefor | — | 2023-07-11 |
| 11634600 | Ink composition, window using the same, and manufacturing method of window using the same | Ji Won Choi, Dongwoon Lee | 2023-04-25 |
| 11626377 | Semiconductor device | Jung-Hoon Han, Dong-Wan Kim, Jaewon Seo | 2023-04-11 |