Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854989 | Semiconductor package substrate and semiconductor package including the same | Dongho Kim, Jongbo Shim, Hwan Pil Park, Choongbin Yim | 2023-12-26 |
| 11808890 | Distance measuring device and method of measuring distance by using the same | Tatsuhiro Otsuka | 2023-11-07 |
| 11796678 | Optical device and LiDAR system including the same | Yongchul CHO, Tatsuhiro Otsuka | 2023-10-24 |
| 11798889 | Methods of manufacturing semiconductor packages | Choongbin Yim, Jihwang Kim, Jongbo Shim, Kyoungsei Choi | 2023-10-24 |
| 11749775 | Light source-integrated light sensing system and electronic device including the same | Eunkyung LEE, Byounglyong Choi, Heesun Yoon, Inoh Hwang | 2023-09-05 |
| 11695453 | Method for maintaining beamforming in wireless AV system, and wireless device using same | Hyowon Bae, Jinmin Kim, Jaewook Song, Jinsoo CHOI | 2023-07-04 |
| 11675057 | Beam scanning apparatus and optical apparatus including the same | Junghyun PARK, Byunggil JEONG, Changgyun Shin, Byounglyong Choi | 2023-06-13 |
| 11614524 | LiDAR system and method of operating the same | Inoh Hwang, Dongjae Shin, Tatsuhiro Otsuka, Heesun Yoon | 2023-03-28 |
| 11598847 | LiDAR apparatus and method of operating the same | Youngjoon Jo, Kyihwan Park | 2023-03-07 |
| 11581263 | Semiconductor package, and package on package having the same | Choongbin Yim, Jihwang Kim, Jungsoo Byun, Jongbo Shim, Doohwan Lee +3 more | 2023-02-14 |