JB

Jungsoo Byun

Samsung: 1 patents #7,162 of 17,037Top 45%
Overall (2023): #380,886 of 537,848Top 75%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11581263 Semiconductor package, and package on package having the same Choongbin Yim, Jungwoo Kim, Jihwang Kim, Jongbo Shim, Doohwan Lee +3 more 2023-02-14