Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817401 | Semiconductor package including molding layer | Dongho Kim | 2023-11-14 |
| 11804477 | Semiconductor device having package on package structure and method of manufacturing the semiconductor device | Jeonghyun Lee, Jongbo Shim | 2023-10-31 |
| 11798889 | Methods of manufacturing semiconductor packages | Choongbin Yim, Jungwoo Kim, Jongbo Shim, Kyoungsei Choi | 2023-10-24 |
| 11710673 | Interposer and semiconductor package including the same | Choongbin Yim, Dongwook Kim, Hyunki Kim, Jongbo Shim, Sungkyu Park +2 more | 2023-07-25 |
| 11676949 | Semiconductor packages having supporting members | Taeseok Choi, Jongbo Shim | 2023-06-13 |
| 11581263 | Semiconductor package, and package on package having the same | Choongbin Yim, Jungwoo Kim, Jungsoo Byun, Jongbo Shim, Doohwan Lee +3 more | 2023-02-14 |