Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854989 | Semiconductor package substrate and semiconductor package including the same | Dongho Kim, Jongbo Shim, Hwan Pil Park, Jungwoo Kim | 2023-12-26 |
| 11798889 | Methods of manufacturing semiconductor packages | Jungwoo Kim, Jihwang Kim, Jongbo Shim, Kyoungsei Choi | 2023-10-24 |
| 11710673 | Interposer and semiconductor package including the same | Dongwook Kim, Hyunki Kim, Jongbo Shim, Jihwang Kim, Sungkyu Park +2 more | 2023-07-25 |
| 11581263 | Semiconductor package, and package on package having the same | Jungwoo Kim, Jihwang Kim, Jungsoo Byun, Jongbo Shim, Doohwan Lee +3 more | 2023-02-14 |