Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854989 | Semiconductor package substrate and semiconductor package including the same | Dongho Kim, Jongbo Shim, Choongbin Yim, Jungwoo Kim | 2023-12-26 |
HP
Hwan Pil Park
Overall (2023): #418,528 of 537,848Top 80%
1
Patents 2023