Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842941 | Semiconductor package structure and fabrication method thereof | Youngho Kim | 2023-12-12 |
| 11776913 | Semiconductor package and a package-on-package including the same | Dongho Kim | 2023-10-03 |