Issued Patents 2023
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824035 | Method of manufacturing a semiconductor device including bonding layer and adsorption layer | Jaehyung Park, Seokho Kim, Kwangjin Moon, Kyuha Lee, Joohee Jang | 2023-11-21 |
| 11810900 | Semiconductor packages stacked by wafer bonding process and methods of manufacturing the semiconductor packages | Eunsuk Jung, Hyoukyung Cho, Jinnam Kim, Hyungjun Jeon, Kwangjin Moon +1 more | 2023-11-07 |
| 11749587 | Semiconductor device | Jinnam Kim, Seokho Kim, Kwangjin Moon | 2023-09-05 |
| 11749586 | Semiconductor device including through via structure | Sonkwan HWANG, Taeseong Kim, Kwangjin Moon, Hyungjun Jeon | 2023-09-05 |
| 11742351 | Semiconductor device and method of manufacturing the same | Dongsoo Lee, Wonkeun Chung, Suyoung Bae, Jaeyeol Song, Jonghan Lee +2 more | 2023-08-29 |
| 11728197 | Wafer to wafer bonding apparatus and wafer to wafer bonding method | Jaehyun PHEE, Hoechul Kim, Seokho Kim, Taeyeong Kim | 2023-08-15 |
| 11721628 | Semiconductor device | Jinnam Kim, Kwangjin Moon, Hojin Lee, Pilkyu Kang | 2023-08-08 |
| RE49538 | Semiconductor device and method of fabricating the same | Sangjin Hyun, Yugyun Shin, Hongbae Park, Sughun Hong, Hye-Lan Lee +1 more | 2023-05-30 |
| 11658139 | Semiconductor package for improving bonding reliability | Jaehyung Park, Seokho Kim, Seongmin Son, Kyuha Lee, Yikoan Hong | 2023-05-23 |
| 11616036 | Semiconductor device and method of manufacturing the same | Joohee Jang, Seokho Kim, Jaehyung Park, Kyuha Lee | 2023-03-28 |
| 11594443 | Substrate bonding apparatus and method of manufacturing semiconductor device by using the substrate bonding apparatus | Hoechul Kim, Taeyeong Kim, Hakjun Lee | 2023-02-28 |
| 11552096 | Three-dimensional semiconductor devices and method of manufacturing the same | Seungha Oh, Weonhong Kim | 2023-01-10 |