Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810900 | Semiconductor packages stacked by wafer bonding process and methods of manufacturing the semiconductor packages | Eunsuk Jung, Hyoukyung Cho, Hyungjun Jeon, Kwangjin Moon, Hoonjoo Na +1 more | 2023-11-07 |
| 11791137 | Apparatus for etching substrate bevel and semiconductor fabrication method using the same | Hakseung Lee, Ho-Jin Lee, Dong-Chan Lim, Kwangjin Moon | 2023-10-17 |
| 11749587 | Semiconductor device | Seokho Kim, Hoonjoo Na, Kwangjin Moon | 2023-09-05 |
| 11721628 | Semiconductor device | Kwangjin Moon, Hojin Lee, Pilkyu Kang, Hoonjoo Na | 2023-08-08 |
| 11664316 | Semiconductor devices having penetration vias with portions having decreasing widths | Hakseung Lee, Hyoukyung Cho, Taeseong Kim, Kwangjin Moon | 2023-05-30 |