Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810900 | Semiconductor packages stacked by wafer bonding process and methods of manufacturing the semiconductor packages | Eunsuk Jung, Hyoukyung Cho, Jinnam Kim, Kwangjin Moon, Hoonjoo Na +1 more | 2023-11-07 |
| 11804419 | Semiconductor device | Hakseung Lee, Kwangjin Moon, Hyoukyung Cho | 2023-10-31 |
| 11749586 | Semiconductor device including through via structure | Sonkwan HWANG, Taeseong Kim, Hoonjoo Na, Kwangjin Moon | 2023-09-05 |
| 11721562 | Substrate bonding apparatus | Taeyeong Kim, Hoechul Kim, Junhong Min | 2023-08-08 |
| 11694980 | Semiconductor stack and method for manufacturing the same | Kwangjin Moon, Hakseung Lee, Hyoukyung Cho | 2023-07-04 |