Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728197 | Wafer to wafer bonding apparatus and wafer to wafer bonding method | Jaehyun PHEE, Hoechul Kim, Seokho Kim, Hoonjoo Na | 2023-08-15 |
| 11721562 | Substrate bonding apparatus | Hyungjun Jeon, Hoechul Kim, Junhong Min | 2023-08-08 |
| 11594443 | Substrate bonding apparatus and method of manufacturing semiconductor device by using the substrate bonding apparatus | Hoechul Kim, Hakjun Lee, Hoonjoo Na | 2023-02-28 |