Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824035 | Method of manufacturing a semiconductor device including bonding layer and adsorption layer | Jaehyung Park, Hoonjoo Na, Kwangjin Moon, Kyuha Lee, Joohee Jang | 2023-11-21 |
| 11749587 | Semiconductor device | Jinnam Kim, Hoonjoo Na, Kwangjin Moon | 2023-09-05 |
| 11728197 | Wafer to wafer bonding apparatus and wafer to wafer bonding method | Jaehyun PHEE, Hoechul Kim, Taeyeong Kim, Hoonjoo Na | 2023-08-15 |
| 11658139 | Semiconductor package for improving bonding reliability | Jaehyung Park, Hoonjoo Na, Seongmin Son, Kyuha Lee, Yikoan Hong | 2023-05-23 |
| 11616036 | Semiconductor device and method of manufacturing the same | Joohee Jang, Hoonjoo Na, Jaehyung Park, Kyuha Lee | 2023-03-28 |