Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658139 | Semiconductor package for improving bonding reliability | Jaehyung Park, Seokho Kim, Hoonjoo Na, Kyuha Lee, Yikoan Hong | 2023-05-23 |
SS
Seongmin Son
Overall (2023): #260,487 of 537,848Top 50%
1
Patents 2023