Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824035 | Method of manufacturing a semiconductor device including bonding layer and adsorption layer | Seokho Kim, Hoonjoo Na, Kwangjin Moon, Kyuha Lee, Joohee Jang | 2023-11-21 |
| 11658139 | Semiconductor package for improving bonding reliability | Seokho Kim, Hoonjoo Na, Seongmin Son, Kyuha Lee, Yikoan Hong | 2023-05-23 |
| 11616036 | Semiconductor device and method of manufacturing the same | Joohee Jang, Seokho Kim, Hoonjoo Na, Kyuha Lee | 2023-03-28 |