Issued Patents 2023
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824035 | Method of manufacturing a semiconductor device including bonding layer and adsorption layer | Jaehyung Park, Seokho Kim, Hoonjoo Na, Kyuha Lee, Joohee Jang | 2023-11-21 |
| 11810900 | Semiconductor packages stacked by wafer bonding process and methods of manufacturing the semiconductor packages | Eunsuk Jung, Hyoukyung Cho, Jinnam Kim, Hyungjun Jeon, Hoonjoo Na +1 more | 2023-11-07 |
| 11804419 | Semiconductor device | Hakseung Lee, Hyungjun Jeon, Hyoukyung Cho | 2023-10-31 |
| 11791137 | Apparatus for etching substrate bevel and semiconductor fabrication method using the same | Hakseung Lee, Ho-Jin Lee, Dong-Chan Lim, Jinnam Kim | 2023-10-17 |
| 11791211 | Semiconductor devices including through vias and methods of fabricating the same | Yi Koan Hong, Taeseong Kim | 2023-10-17 |
| 11749586 | Semiconductor device including through via structure | Sonkwan HWANG, Taeseong Kim, Hoonjoo Na, Hyungjun Jeon | 2023-09-05 |
| 11749587 | Semiconductor device | Jinnam Kim, Seokho Kim, Hoonjoo Na | 2023-09-05 |
| 11728245 | Semiconductor device and semiconductor package including penetration via structure | Jubin Seo, Kunsang Park, Myungjoo Park, Sujeong Park, Jaewon Hwang | 2023-08-15 |
| 11721628 | Semiconductor device | Jinnam Kim, Hojin Lee, Pilkyu Kang, Hoonjoo Na | 2023-08-08 |
| 11694980 | Semiconductor stack and method for manufacturing the same | Hyungjun Jeon, Hakseung Lee, Hyoukyung Cho | 2023-07-04 |
| 11664316 | Semiconductor devices having penetration vias with portions having decreasing widths | Hakseung Lee, Jinnam Kim, Hyoukyung Cho, Taeseong Kim | 2023-05-30 |
| 11600553 | Semiconductor device including through substrate vias and method of manufacturing the semiconductor device | Myungjoo Park, Jaewon Hwang, Kunsang Park | 2023-03-07 |
| 11581279 | Semiconductor device | Ju-Il Choi, Sujeong Park, Jubin Seo, Jin Ho An, Dong-Chan Lim +1 more | 2023-02-14 |